
Releases
Extropic Secures $75 Million CHIPS Funding for Thermodynamic AI Chips
Extropic has signed a letter of intent with the U.S. Department of Commerce for up to $75 million in CHIPS R&D funding. The capital aims to accelerate the development of Thermodynamic Sampling Units, a novel class of chips that leverage natural transistor fluctuations to process AI workloads with superior energy efficiency.


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